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View Single Post  Topic: New System Provides Unparalleled Thermal Stress Measurements 
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Doctor Feelgood
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PostPosted: Fri, 31 Mar 2017 08:44:09    Post Subject: New System Provides Unparalleled Thermal Stress Measurements Reply with quote

k-Space, a worldwide supplier of advanced in situ, ex situ, and in-line metrology tools for the semiconductor industry, announced that a leading innovator in nanotechnology research and technology, Leti, has installed a kSA MOS ThermalScan system for the measurement of film stress and wafer curvature.

The custom kSA MOS ThermalScan is capable of measuring wafers up to 300mm in diameter from 20°C to 1000°C. The system is configured to use either a full 300 mm quartz viewport for full wafer mapping at temperatures up to 600°C, or 300mm x 20mm linear slit viewport for linear scans up to 1000°C.

Dr. Charles Taylor, Product Development Manager at k-Space commented that "No other film stress measurement tool on the market can accurately measure film stress over such a wide temperature range. The key to thermal stress measurements is uniformity – since temperature non-uniformity leads to wafer bow that is unrelated to film stress. We have collaborated very closely with our vendors to develop a tool capable of reaching the temperature ranges required by our customers while maintaining wafer temperature uniformity. Combined with our patented multi-beam laser array measurement technique that allows localized curvature measurements with high spatial resolution, the kSA MOS ThermalScan provides unparalleled resolution and repeatability in thermal stress measurements."
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